PCB Industrialization & Qualification

ºsic Function: Perform industrialization activities for new products. Position will require performing the following tasks (but not limited to): Part/Product design review, detailed cost analysis for part and processes, make or buy decisions, strategic production layout, cycle/takt time studies, strategic sourcing decisions, DFM / DFA / DFX analysis and component standardization. Focus is to secure a developed process for qualification of PCB suppliers and to conduct activities in the supplier qualification process. On product level the responsibility is to perform technical evaluation regarding PCB technology development and review technical reports from suppliers. Towards design community and development projects provide support regarding technology development for PCB, maintaining network of contacts both external and internal. Research and suggest tools for improving quality and efficiency of PCB design Maintaining a high competence to evaluate and make assessments on PCB by utilizing design rules, requirement specification, product documentation, UL requirements and environmental requirements. Capable of effectively working with electrical, mechanical, and manufacturing engineering disciplines in a team environment with good understanding of cross functional design process We are part of a global community and we cooperate with other units within Schneider Electric to use best practice as well as reuse our solutions as much as possible. Essential function: Should be well versed with the complete PCB manufacturing process, PCB industry, state of the art PCB technology, and cost drivers Review the Fabrication drawing & study all the requirements applicable for PCB. Should have in depth knowledge of IPC standards for qualification & acceptance criteria of PCBAs. Replying to Engineering queries from vendor by analyzing the Gerber & interacting with Design, Process & production team. Perform detailed error checks, post processing, Gerber files, etc. to facilitate successful board manufacturing Should have knowledge of different laminates, Solder mask Ink, Surface finish requirements, Material properties such as Tg, Td, CTE values. Preparing the micro section of sample PCB. This is very critical process for qualification of PCB & it is must to have this knowledge. In depth study of the micro section prepared. Includes analysis of all hole wall properties, Di electric thickness, Copper thickness, Solder mask thickness measurement & validation of number of di electric layers. Measurement of different size of holes & board dimension. BOW & TWIST measurement according to IPC standard. Should be able to do Solderability test & analyze the solderability as per IPC standard. Complete review of vendor FAIR which includes the laminate & Solder mask details, cross section report, Bare board testing, Thermal stress, Ionic contamination, Mechanical dimensions & ROHS declaration. Calculation of Impedance values in Polaris software. Should be able calculated the right dielectric thickness, Trace width & trace thickness to achieve the impedance values. Should have knowledge of UL certification for different types of PCBAs.
LI-MA3 Qualifications Bachelor of Engineering Electronics/ Electrical/ Instrumentation or relevant discipline, with several years of experience as an engineer or similar line of work. Analytic thinking. Understand large systems and hardware.
LI-MA3 Schedule: Full-time Req: 008BP1