Equipment Engineer

Overview OSI Systems companies have a long history of developing innovative solutions to bring a better quality of life to the world. With more than 30 years of combined experience in the field of optoelectronics our OSI Optoelectronics (OSIO) division is a diversified manufacturer of standard and custom photodiodes and optical sensors for used in aerospace, defense, commercial and medical applications. We are one of the largest global manufacturers of optoelectronic devices, delivering engineering design support and manufacturing capabilities that include products for use in the defense, aerospace, medical, and industrial markets, among others. We utilize our world-class manufacturing facilities in the U.S., India and Malaysia to continue to put forth excellent engineering solutions aligned with efficient manufacturing to meet high-volume production requirements. Responsibilities To maintain the machine performance through preventive maintenance and predictive maintenance. Monitor equipment performance key indicators and responsible to meet expectation. Establish spare inventory system for key equipment. Monitor spare cost and drive down liabilities of spare inventories. Work with Purchasing to identify critical suppliers and develop 2nd sourcing strategy. Identify the key cost drivers and work on cost reduction programs and rovide necessary production support on performing critical product conversions. Work with the team on continue improvement programs which base on equipment down time and machine assists. To support manufacturing in order to meet the output and cycle time and take ownership to work with cross functional team to resolve yield and quality issues. Responsibility to ensure zero safety incident at workplace, 5S activities at die attach & wire bond area. Responsible for Equipment control documentation, preventive maintenance checklist etc. Experience in wafer dicing equipment (DISCO) is an advantage. Experience in PCB board level debugging & repair is an advantage. Qualifications Degree in Mechanical, Mechatronics, Electrical & Electronics or related Engineering Minimum 2 years of working Experience in Electronic manufacturing company. Experience in using maintening semiconductor assembly equipments Expertise with Die attach and wire bonding machine Self-motivated, possess initiative and ability to work independently. Team player with good communication and interpersonal skill.