Engineering Manager

Overview OSI Systems companies have a long history of developing innovative solutions to bring a better quality of life to the world. With more than 30 years of combined experience in the field of optoelectronics our OSI Optoelectronics (OSIO) division is a diversified manufacturer of standard and custom photodiodes and optical sensors for used in aerospace, defense, commercial and medical applications. We are one of the largest global manufacturers of optoelectronic devices, delivering engineering design support and manufacturing capabilities that include products for use in the defense, aerospace, medical, and industrial markets, among others. We utilize our world-class manufacturing facilities in the U.S., India and Malaysia to continue to put forth excellent engineering solutions aligned with efficient manufacturing to meet high-volume production requirements. Responsibilities Effectively manage the team of Engineers and Technicians to support the manufacturing activities in IC Packaging division. Overall responsibility for New Project, Product, Process & Equipment Engineering. Ensure right Training & Development of the team to enhance the knowledge and skills. Manages Seamless execution of product/process/technology transfer, NPI & product ramp. Process development for the new products and Process Improvement for existing ones. Decide and procure most suitable manufacturing & test equipment as required. Work on process automation wherever necessary & possible. Keep up with industry trends & customer requirements for IC Packaging Technology. Handle project from First Article qualification process through Mass Production. Provides continual engineering support to operations to meet the final yield targets. Works with product development teams to ensure design for manufacturability. Uphold the company’s core values of Integrity, Innovation, Accountability, and Teamwork Demonstrate behavior consistent with the company’s Code of Ethics and Conduct Duties may be modified or assigned at any time to meet the needs of the business. Qualifications Bachelor’s Degree in engineering in Electronics related streams. Experience in equivalent position for min. 7 Years Excellent communication in English In depth technical knowledge of IC Packaging process and operation Familiarization with JEDEC & MIL Standards Well versed with the of IC Packaging Equipment, like … Die Attach, Wire Bond, Molding, all other allied production equipment, and tooling. Hands on experience is preferred. Aware of various Test & Measurement equipment. Should be aware of functionality of optical sensors, especially the Photo detectors. Knowledge of functioning of X-Ray scanning systems will be an added advantage. Excellent problem-solving abilities Strong analytical, organizational and leadership skills and a track record of accomplishment working with cross functional teams